| Type | Announcement |
| Subject | NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) FUND RAISING |
| Description |
HIAP HUAT HOLDINGS BERHAD ("HIAP HUAT" OR THE "COMPANY") PRIVATE PLACEMENT |
Reference is made to the Company’s announcements dated 24 May 2021, 28 May 2021, 9 June 2021 and 10 June 2021 in relation to the Private Placement (“Announcements”). Unless otherwise defined, capitalised terms used in this announcement shall have the same meanings as defined in the aforesaid Announcements.
On behalf of the Board, HLIB wishes to announce that the Board has fixed the issue price at RM0.135 per Placement Share for the Private Placement today. The issue price of RM0.135 per Placement Share represents a discount of approximately 8.1% to the 5-day VWAMP of the Shares up to and including 26 July 2021 of RM0.1469 per Share.
This announcement is dated 27 July 2021.
| Company Name | HIAP HUAT HOLDINGS BERHAD |
| Stock Name | HHHCORP |
| Date Announced | 27 Jul 2021 |
| Category | General Announcement for PLC |
| Reference Number | GA1-27072021-00023 |